Best suitable on needs for actual signal evaluation of High Speed LSI.
- High-Speed Signal Probe Socket has composed with Signal Probe Base Socket,
Lid and Alignment Frame. Signal Probe Base socket must be adjusted and
located on an application PCB by Alignment Frame. LSI for waveform check and
signal probe or measurement must be loaded to Signal Probe Base Socket and
be fixed by lid. Actual signal or waveform will be checked from a. land terminal
on signal probe interposer board composed in Signal Probe Base Socket
- It must be required High-Speed PHY(Physical Layer) design and evaluation
for an actual application board or system to realize circuit waveform verification
and mounting states verification with Transmission performance confirmation.
(for signal patterns on Evaluation board)
- It must be needed R/W timing analysis and verification between high-speed
and High-Speed CPU I/O on behind or between package terminal and
PCB land at product development and evaluation scenes.
- Reconfirmation or analysis must be required for Manufacturing site an
Division of Quality Control scenes, as like for failure analysis and for feed-backed
- Solder-less mount
Easy device replacement and High durability (20K cycles)
Unnecessary “re-flow and re-ball” process
Reusable to other compatible products
- Be able to check and observe all signals terminal(DDR device)
- Support to "InfiniiSim Oscilloscopes (Infiniium90000 / Infiniium9000 series)"
produced by Keysight technology
- Be able to provide S-parameter (Touchstone data : .s2p) of interposer
- Available to make modification for customized requirement
Various type of Alignment Frame be available.
→POP devices (such as MCP)
DDR Memory BGA Probing Socket using for Evaluative Analysis
Signal Probing Socket for Productions Board