SER sockets are available in two types, for both solder and solderless
mounting onto PCBs. They are most suitable for engineering evaluation and
verification of the functions and performance of ASIC, ASSP, MCU or Custom LSI
at the development or implementation stage.
These IC sockets are designed based on specific IC characteristics and
customer requirements. For example, solutions are available for needs such as
high-frequency performance over 80GHz, high-current probe requirements,
device surface temperature checking, terminal signal checking and evaluation
for probes on the hidden side of BGA/LGA devices, heat sink design for
high-power consumption,complete non-magnetic contact probes and sockets, and
extended high-temperature and low-temperature operation. SER will meet
any LSI socket design requirements by choosing the appropriate contact elements
and structural materials.
SER can provide low cost sockets for FBGA/CSP/LGA and more, by using
economical contact elements. For instance, these IC sockets are ideal for the
module sockets of high
various kinds of processors. It is a highly reliable socket that is compatible with
any test environment, the cap to match the size and configuration of the device.
The final tests of LSI or WLCSP require stable, low-resistance contact with
more than 300k cycle durability; for WLCSP 1,000k cycles are a common testing
SER can provide highly reliable contact elements and IC sockets
by combining engineering ability developed through extensive experience,
and technology for ultra precise processing, microfabricaiton processing and surface
finishing. SER Final Test Sockets achieve high performance with excellent features
for various device types such as FBGA, CSP, LGA or QFP, and also for wafer level
WLCSP, with superior performance for 80GHz transmission, high current 2A per
terminal, and complete non-magnetic probes, sockets and/or coaxial probe contacts.
SER have sockets for image sensors. We provide customized products to fit
terminals of various devices, such as LGA (PAD), BGA (ball), PGA (post), etc.
We also provide socket caps with openings for optical testing, and using black
materials to prevent reflection is also an option. For mass production sockets,
we produce a butterfly cap compatible with a mass production handler.
We can also handle high-speed serial interfaces such as MIPI (D-PHY), SLVS, etc.
The FPGA/CPLD IC socket series is ideal for circuit development and operation
verification of the LSI series available from Xilinx, Altera and others.
For selection, the socket series is indexed with the the same model number as
the FPGA/CPLD device number, i.e. FF1930-S2, for the FF, FT, BG, FG, CS
series with pitches of 1.27mm, 1.0mm, 0.8mm and 0.5mm.
The FPGA/CPLD IC socket series is most suitable for IC verification or evaluation,
and can be easily mounted using the four mount holes and two alignment key holes,
with no need for soldering. It provides superior performance for LSI development
and evaluation for high-speed SerDes signal transmissions as well as
In addition the socket cap has been designed with a heat sink to deal with the heat
produced by devices with high probe counts and/or high power consumption.
The FPGA/CPLD IC socket series device or IC Socket itself can be reused.