The FPGA/CPLD IC socket series is ideal for circuit development and operation
verification of the LSI series available from Xilinx, Altera and others.
For selection, the socket series is indexed with the the same model number as
the FPGA/CPLD package number, i.e. FF1930-S2, for the FF, FT, BG, FG, CS
series with pitches of 1.27mm, 1.0mm, 0.8mm and 0.5mm.
The FPGA/CPLD IC socket series is most suitable for IC verification or evaluation,
and can be easily mounted using the four mount holes and two alignment key holes,
with no need for soldering. It provides superior performance for LSI development
and evaluation for SerDes signal transmissions over 32Gbps, as well as
In addition the socket cover has been designed with a heat sink to deal with the heat
produced by devices with high probe counts and/or high power consumption.
The FPGA/CPLD IC socket series package or IC Socket itself can be reused.
SER sockets are available in two types, for both solder and solderless
mounting onto PCBs. They are most suitable for engineering evaluation and
verification of the functions and performance of ASIC, ASSP, MCU or Custom LSI
at the development or implementation stage.
These IC sockets are designed based on specific IC characteristics and
customer requirements. For example, solutions are available for needs such as
high-frequency performance over 50GHz, high-current probe requirements,
package surface temperature checking, terminal signal checking and evaluation
for probes on the hidden side of BGA/LGA packages, heat sink design for
high-power consumption,complete non-magnetic contact probes and sockets, and
extended high-temperature and low-temperature operation. SER will meet
any LSI socket design requirements by choosing the appropriate contact elements
and structural materials.
SER can provide low cost sockets for FBGA/CSP/LGA and more, by using
economical contact elements such as RC connect-R. For instance, these IC sockets
are ideal for the module sockets of optical engines (50GHz bandwidth), as well as
for sockets for various kinds of processors. It is a highly reliable socket that is
compatible with any test environment, designed with a one-piece base combined with
a ladder contact, and lid to match the size and configuration of the package.
The final tests of LSI or WLCSP require stable, low-resistance contact with
more than 300k cycle durability; for WLCSP 1,000k cycles are a common testing
requirement. SER can provide highly reliable contact elements and IC sockets
by combining engineering ability developed through extensive experience,
and technology for precise processing, surface finishing and high quality milling.
SER Final Test Sockets achieve high performance with excellent features
for various package types such as FBGA, CSP, LGA or QFP, and also for
wafer level WLCSP, with superior performance for 50GHz transmission, high current
2A per terminal, and non-magnetic probes, sockets and/or coaxial probe contacts.
SER have sockets for image sensors. We provide customized products to fit
terminals of various packages, such as LGA (PAD), BGA (ball), PGA (post), etc.
We also provide socket caps with openings for optical testing, and using black
materials to prevent reflection is also an option. For mass production sockets,
we produce a butterfly cap compatible with a mass production handler.
We can also handle high-speed serial interfaces such as MIPI (D-PHY), SLVS, etc.