FPGA/CPLD IC socket series are ideal for circuit development and operating
verification of LSI series available from Xilinx, Altera and etc. The socket series
type number has assigned same number as FPGA/CPLD package number as like
for FF, FT, BG, FG, CS and the pitch of 1.27mm, 1.0mm, 0.8mm and 0.5mm.
FPGA/CPLD IC socket series are best suitable for IC verification or evaluation
with solderless assembly to the PCB by only four screw mount holes and 2 of
alignment key holes for mounting. It has superior performance on a LSI
development and evaluation as like for 32 Gbps SerDes signal transmission or
receiving design confirmation.
Also the socket lid has been designed by considered with high number of probe
count or high power consumption device with calculating heat sink. FPGA/CPLD
IC socket series are able to reuse a package or IC socket itself.
SER socket is available for both of solder mount type and solderless
mount type onto PCB. They are best suitable for engineering evaluation
or verification on development of ASIC, ASSP, MCU or Custom LSI
belong with its features.
These IC sockets are designed by considering individual IC characteristic
and customer’s requirement. For instance, it is available to meet high-
frequency performance more than 50GHz, high-current characteristic
probe requirement, check package surface temperature, check and
evaluation terminal signal for hidden side of BGA/LGA PKG, heat sink
design for high-power dissipation , complete non-magnetic contact
probe and socket, extended high-temperature and low-temperature
operating. SER would like to respond for any design requirement of LSI
socket by choosing appropriate contact element and structural
SER can provide low cost type sockets for FBGA/CSP/LGA etc., by using
economical Contact Element as like RC connect-R. For instance, these IC
sockets are ideal for module socket of optical engine(50GHz bandwidth), and
like for various kind of processors.
It is high-reliable socket to meet any test environment, designed with one
piece base combined with a feature of ladder contact, and appropriate lid for
PKG configuration or size.
The final test of LSI or WLCSP is required stable contact resistance and
durability over 300k cycles. Especially 1,000k cycles would be required
for WLCSP testing as like common requirement.
SER can provide high reliability contact element and IC socket by
combining engineering, deep experience and the technology for precise
machining processing, surface finish technology and highest reliable
SER make it realize highest performance Final Test Socket as like for
various type package FBGA, CSP, LGA or QFP and like for type wafer
level’s WLCSP with superior performance of 50GHz transmission, high
current 2A per terminal, non magnetic probe and socket or Coaxial
Probe contact with excellent features.